Module Development and Fabrication

Besides meeting customer needs for mounting various parts and sensors on FPCs and checking operation thereof, we are responding to requests for modules that build-in electrical and mechanical performances by utilizing the advantages of FPCs, and reduce space and costs by combining technologies for interboard connections and molding.

We realize 3-dimensional modules by bending FPCs, and installing on outer casings, and are supplying them to customers.

We are responding to demands for highly functional modules by using ACF and solder, besides more conventional connectors, for connections.

We are adding waterproof property and enhancing mechanical strength by applying coatings to electronic components, molding gaskets to FPCs and molding within FPCs.