Double-sided Fine-pitch FPC
Features
We developed FPC with fine-pitch circuit (high-density wiring, high-aspect ratio) using unique circuit forming technology. It enables more flexibility with circuit design, e.g. high-density mounting.
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-Mass-produced item-
【Cross-sectional image】
-Developed item-
【Cross-sectional image】
We are also developing a technology to create tall and short fine-pitch circuits on the same layer.
This technology will make it possible to form both power supply circuits and high-density signal circuits on the same layer.
【SEM image】
【Cross-sectional image】
Flat coil
Features
Our fine-pitch circuits forming technology is applied to flat coil FPCs with spiral circuits, which are being
mass-produced. Smaller and thinner FPCs are actualized by forming flat coil circuits on thin substrates.
【Image】
【SEM image】
【Cross-sectional image】
【Cross-sectional image】
４layer coil(developed by R&D)
【Cross-sectional image】
Applications
FPC for display
High-density wiring enables mounted components and ICs, etc.
to be placed in any positions or sides.
Actuator coil for camera optical image stabilization (OIS)
Our original thick copper wiring technology enables
high aspect ratio circuits.
Please feel free to contact us. Our representative will return your contact afterwards.