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Module Development and Fabrication

Module Development and Fabrication

Besides meeting customer needs for mounting various parts and sensors on FPCs and checking operation thereoff, we are responding to requests for modules that build-in electrical and mechanical performances by utilizing the advantages of FPCs, and reduce space and costs by combining technologies for interboard connections and molding.

Features

Feature 1

Space Reductions via 3-Dimensional Structuring

We realize 3-dimensional modules by bending FPCs, and installing on outer casings, and are supplying them to customers.

Space Reductions via 3-Dimensional Structuring
Feature 2

Interboard Connections

We are responding to demands for highly functional modules by using ACF and solder, besides more conventional connectors, for connections.

Interboard  Connections
Feature 3

Waterproof ing

We are adding waterproof property and enhancing mechanical strength by applying coatings to electronic components, molding gaskets to FPCs and molding within FPCs.

  • Waterproofing at Outer Case Area  (Gasket is mold formed)

    Waterproofing at Outer Case Area
    (Gasket is mold formed)

  • Waterproofing at Sliding Area (Film Structure)

    Waterproofing at Sliding Area
    (Film Structure)

  • Waterproofing at Bending Area (FPC Inside)

    Waterproofing at Bending Area
    (FPC Inside)
    [Under Development]

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